Apr 22, 2026
SK Hynix (000660) Commits $13B to Advanced HBM Packaging Facility in South Korea
SK Hynix announces $13B South Korea plant for HBM chip packaging targeting AI data centers, with construction starting April 2026. Stock slips 1% on news.
The post SK Hynix (000660) Commits $13B to Advanced HBM Packaging Facility in South Korea appeared first on Blockonomi.
Source: Blockonomi →Related News
- 30 minutes ago
BlackRock in Talks to Invest Up to $10 Billion in SpaceX IPO Ahead of June Listi...
- 8 hours ago
7 Stock Sectors Poised to Dominate the Next Half-Decade: AI, Defense, and Beyond
- 8 hours ago
Nvidia (NVDA) Stock Expands CoreWeave (CRWV) Holdings by 95% in Strategic AI Pla...
- 8 hours ago
Wall Street’s Elite Quietly Accumulated These 5 Stocks in Q1 2026 – Microsoft (M...
- 8 hours ago
Macy’s (M) Stock Surges 6% as Berkshire Hathaway Takes $55M Position
