SK Hynix Stock: Why This Chipmaker Is Betting $13B on AI Memory

TLDR SK Hynix commits $12.9 billion to build advanced packaging facility in Cheongju with April construction start and late 2027 completion date New plant will produce high-bandwidth memory chips using advanced packaging that stacks chips vertically for AI applications Company controls 61% of global HBM market, ahead of Samsung at 19% and Micron at 20% [...]

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